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| Tipoffs: DEI Newsletter for 2026-03-11 ( 4 items ) |
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Composition, Method of Forming Resist Underlayer Film, and Method of Forming Resist Pattern (10)
ALEXANDRIA, Virginia, March 10 -- JSR CORPORATION, Tokyo, Japan has been assigned a patent (No. US 12572075 B2, initially filed Sept. 12, 2022) developed by six inventors Yugaku Takagi, Tokyo, Japan; Tsubasa Abe, Tokyo, Japan; Takashi Katagiri, Tokyo, Japan; Satoshi Dei, Tokyo, Japan; Kazunori Takanashi, Tokyo, Japan; and Yuya Hayashi, Tokyo, Japan, for "Composition, method of forming resist underlayer film, and method of forming resist pattern." more PT
Foundation for Economic Education Issues Commentary: Life of Frederic Bastiat (10)
DETROIT, Michigan, March 11 -- The Foundation for Economic Education issued the following commentary on March 10, 2026, by President Emeritus Lawrence W. Reed:
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The Life of Frederic Bastiat
France's great classical liberal.
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Two hundred and fifty years ago this month, the Scottish philosopher and economist Adam Smith's monumental work, An Inquiry Into the Nature and Causes of the Wealth of Nations, was published. Its lasting impact means that it belongs on any list of the 100 most inf more PR
Heritage Action Applauds Passage of Florida Bill to End Taxpayer-Funded DEI (10)
WASHINGTON, March 10 [Category: Political] -- Heritage Action for America posted the following news release:
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Heritage Action Applauds Passage of Florida Bill to End Taxpayer-Funded DEI
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March 10, 2026, Washington, D.C. -Heritage Action today praised the Florida Legislature for passing SB 1134, legislation prohibiting counties and municipalities from using taxpayer dollars to fund "Diversity, Equity, and Inclusion" (DEI) offices that offer "bias" training and focus hiring practices on more PR
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, in-Vehicle Electronic Circuit, ECU Electronic Circuit, in-Vehicle Electronic Circuit Device and ECU Electronic Circuit Device (10)
ALEXANDRIA, Virginia, March 10 -- SENJU METAL INDUSTRY CO., LTD., Tokyo, Japan has been assigned a patent (No. US 12569941 B2, initially filed June 18, 2024) developed by five inventors Shunsaku Yoshikawa, Tokyo, Japan; Takashi Saito, Tokyo, Japan; Yuuki Iijima, Tokyo, Japan; Kanta Dei, Tokyo, Japan; and Takahiro Matsufuji, Tokyo, Japan, for "Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circui more PT
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