U.S. Patents Awarded to Inventors in Arizona (May 12)
zPatents (by State)
Copyright © Targeted News Service, 2026
Copyright © Targeted News Service, 2026
2026-05-12
Targeted News Service
ALEXANDRIA, Va., May 12 -- The following federal patents were awarded to inventors in Arizona.
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Chip-Scale Package Architectures Containing a Die Back Side Metal and a Solder Thermal Interface Material
ALEXANDRIA, Virginia, May 12 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12628645 B2, initially filed June 14, 2024) developed by five inventors Susmriti Das Mahapatra, Tempe, Arizona; Malavarayan Sankarasubramanian, Ch . . .
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TARGETED NEWS SERVICE (founded 2004) features non-partisan 'edited journalism' news briefs and information for news organizations, public policy groups and other organizations. For more information contact MYRON STRUCK, editor, editor@targetednews.com, Springfield, Virginia; 703/304-1897; https://targetednews.com
ALEXANDRIA, Va., May 12 -- The following federal patents were awarded to inventors in Arizona.
***
Chip-Scale Package Architectures Containing a Die Back Side Metal and a Solder Thermal Interface Material
ALEXANDRIA, Virginia, May 12 -- INTEL CORPORATION, Santa Clara, California has been assigned a patent (No. US 12628645 B2, initially filed June 14, 2024) developed by five inventors Susmriti Das Mahapatra, Tempe, Arizona; Malavarayan Sankarasubramanian, Ch . . .
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TARGETED NEWS SERVICE (founded 2004) features non-partisan 'edited journalism' news briefs and information for news organizations, public policy groups and other organizations. For more information contact MYRON STRUCK, editor, editor@targetednews.com, Springfield, Virginia; 703/304-1897; https://targetednews.com
